AMD Zen 7 details revealed: Launch Date and Specifications
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14:19, 26.05.2026
The insight information from the Commercial Times disclosed details regarding AMD Zen 7. The new chiplet has the Grimlock codename and is based on TSMC’s 1.4-nm A14 process. Officially, AMD has not confirmed this information.
Details regarding AMD Zen 7
According to the revealed information, mass production is going to start in 2028, and pilot production may start the next year. AMD is making a strategic decision to skip intermediate nodes and use A14. This will be the first such node where feature sizes will be less than a nanometer.
AMD Zen 7 will support 16 cores per CCD, and the flagship configuration will have 32 cores on 2 CCDs. Also, it is expected that the next gen of 3D V-Cache will add up to 224 MB of L3 cache per CCD. This is a significant change compared to the current Zen 5 X3D, which only has 96 MB.
Also, AMD is planning to utilize new FOPLP or fan-out panel-level packaging technology. It gives the possibility of placing more chiplets on one substrate and, at the same time, uses less area. In addition to this, the company is actively planning the development of ASIC solutions for inter-chiplet connections.
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