Presentation of a Unique Gallium Nitride Chiplet
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12:21, 10.04.2026
Intel Foundry has unveiled the thinnest gallium nitride chiplet to date. The new chiplet is reported to be 19 micrometers thick. This GaN-based chiplet, fabricated on 300-nm wafers, could significantly influence the future development of semiconductors.
Features of the new development
Researchers were able to combine conventional silicon chips with GaN transistors on a single chip. More complex computational functions can be more easily integrated into energy-efficient chips.
This new technology could further influence the development of more efficient devices for 5G/6G communication networks and data centers. The chiplet features fully monolithic digital controllers on the chip. Thus, this innovative approach can ensure better performance, efficiency, and speed.
Chiplets can be more energy-efficient than standard silicon equivalents. This makes it possible to create smaller voltage regulators, thereby minimizing resistive power losses.
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