Samsung Integrates Mini-Radiator Into Exynos 2600 to Combat Overheating

Samsung is preparing a revolutionary update to its mobile processor lineup, the Exynos 2600, which will feature a built-in cooling system. According to industry sources, the company will introduce a Heat Pass Block (HPB) component for the first time, designed to significantly improve heat dissipation and, accordingly, increase the stability and performance of the chip.

What is Heat Pass Block and How Does It Work?

HPB is essentially a miniature heat sink (presumably copper) built directly into the chip structure. It is located above the computing cores and RAM, ensuring more even heat distribution. Samsung has already used a similar approach in previous solutions, but this is the first time it has combined it with the central logic within a single package.

Both key elements, HPB and DRAM, will be packaged into a single crystal using Fan-out Wafer Level Packaging (FOWLP) technology. Unlike the traditional placement of a chip in a standard housing, a plastic or epoxy substrate is used here, which allows for more flexible heat dissipation management and reduces the thickness of the entire module.

Exynos 2600 Is Already Showing Success

The Exynos 2600 prototype has already passed its first tests and shown performance 18% higher than its Qualcomm competitor. If the commercial version maintains these performance levels at a stable temperature, the chip could restore Samsung's leading position in the Android processor segment.