Intel’s 18A Process Is Finally Here: A Game-Changer for the Chip Industry

Intel has announced that its advanced 18A process node is now ready, with plans to tape out chips by the first half of 2025. This development is a significant milestone in Intel's efforts to regain leadership in semiconductor manufacturing.

Intel 18A Process Node: What Is It?

The 18A process node, which is equivalent to 1.8 nanometers, represents a substantial advancement in chip development technology. It introduces innovations such as RibbonFET transistors and PowerVia backside power delivery, aiming to enhance performance and energy efficiency. These technologies are expected to deliver a sufficient performance gain.

Challenges and Competition

Intel's 18A process, featuring Backside Power Delivery Network (BSPDN) and RibbonFET Gate-All-Around (GAA) technology, is aimed to challenge leading competitors like TSMC with its high chip densities. This technology aims to position Intel as a major player in the semiconductor market.

Looking Ahead

Intel plans to debut 18A in its upcoming Panther Lake mobile SoCs and Clearwater Forest Xeon server CPUs. There are also rumors that Intel's next-generation Celestial dGPUs will leverage this process.

While there were no confirmed announcements of external partnerships, Broadcom and other companies are reportedly interested. With tape-outs scheduled for the first half of 2025, 18A-based products can be anticipated to appear in the second half of 2025.