Chips with Vertical Architecture and the First Six-Layer Microchip
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12:32, 20.10.2025
Researchers from KAUST University in Saudi Arabia have created the world's first six-layer hybrid CMOS chip. This is considered a breakthrough, as previously, the vertical architecture was limited to only two active layers. Such a technology could be a major step towards energy-efficient electronics.
Overcoming Manufacturing Limitations
The main problem that prevented the creation of such a chip earlier was the damage to the lower layers caused by high temperatures. Therefore, scientists created an innovative process that involves temperatures up to 150°C, predominantly at room temperature. This allowed the combination of transistor layers made of organic and inorganic materials. The chip proved that vertical stacking provides higher performance with less overheating.
Potential
Vertical architecture holds immense potential for flexible and wearable electronics, including compact medical devices and sensors. The chips can deliver powerful computing using minimal energy consumption. The KAUST team is currently working on improving the stability of the new technology for its further commercial production.
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