Mass Production of HBM3E Begins Despite a High Defect Rate
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11:51, 29.10.2026
CXMT starts the production of HBM3E, despite the fact that the percentage of usable chips is only reaching 20. This high-bandwidth type of memory is mainly oriented toward the needs of AI processors.
Insider’s information about the new memory
The decision regarding manufacturing is being sped up due to the obvious shortage of AI memory and the necessity of developing equivalents to Nvidia AI accelerators. The company is planning to launch small-scale production in the following 2-month period. The major issue is that the percentage of usable products is only in the range of 20 to 30 percent.
HBM functions by vertical stacking of chips, which guarantees exceptional data exchange speed with the processors. This aspect is fundamental for AI accelerators and further training of LLMs. Due to the intensification of US export controls, it is challenging to get access to such memory type in China.
According to unofficial reports, CXMT started development of this type of memory back in 2024, and despite low production of usable products, the company continues to work on this project.
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